• Single and Double Sided
• Multilayers to 8 Layers
• Through Hole and Surface Mount
• Heavy Copper Outer Layers to 4 Ounce
• Plated Through Slots and Edges

End Item Capabilities

• Board Thickness - .008 to .125
• Lines and Spaces to .006
• SMT Pitch to 25 Mil
• Min. Finished Hole size .012

Final Finishes

• Solder Mask Over Bare Copper (SMOBC)
• Hot Air Leveled Solder
• Reflowed Solder
• Immersion (electroless) full surface gold
• Entek
  

Solder Masks

• Wet Mask – Matt or Gloss
• Liquid Photo Imageable (LPI)

Material Types

• FR-4, CEM 1 and CEM3
• Polyimide
• Teflon
• Flex (Kapton)

Testing Services

• Single Sided Test Fixtures
• Clam Shell Fixtures
• Net List Testing